商业PPT模板Surface micromachined RF MEMS solenoid inducto

Surface micromachined RF MEMS solenoid inductors and variable capacitors Dong-Ming Fang Outline Background Introduction Introduction Introduction Introduction Introduction Introduction Introduction Introduction Introduction Simulation Simulation Simulation Simulation Fig.1. HFSS model of the inductor and the capacitor Fabrication Fig.2. Structure of air-core solenoid inductor Fabrication Fig.4. The fabrication process … Result Results Conclusion fangdm@ime.pku.edu.cn 微电子学研究院 微米纳米加工技术国家级重点实验室 第一届微纳米企业研讨会（无锡） 方东明 May 10, 2008 * 第一届微纳米企业研讨会（无锡） May 10, 2008 Introduction Simulation Fabrication Results Conclusion Outline High frequency High performance Capacitor Inductor Resonance frequency Q-factor Inductance Our desired goal IC Size Performance Wireless communication Mobile communication Global Position System Cost Radio-broadcast transmitter Non-contact IC card Resonator Power amplifier Filter Oscillator Microwave field Applications of microinductors and microcapapcitors Low power Highly integrated Multifunction Low weight Low cost Small size Systems On Chip Main factors affecting the performance of inductors and capacitors Substrate Metal Insulated material Geometrical parameters Sacrificial material Process Three types of MEMS inductor Solenoid-type Meander-type Spiral-type MEMS Inductor Quality Factor Inductance Resonant Frequency The most important figures of merit of the microinductor 0.5 10 30 Magnetic-core improved small vertical 3 6 5.5 1 Resonant Frequency (GHz) 30 35 24 5 small Quality Factor 3 4 1 small small Inductance(nH) Air-core Sus-pended vertical planar planar Type Perfor- mance Solenoid Spiral Meander TableⅠ Comparison of the three types of MEMS inductors MEMS Capacitor comb Three parallel plates Two parallel plates Three types of MEMS capacitor Quality Factor Capacitance Tunable Range The most important figures of merit of the microcapacitor piezio- resist horizontal heat two plates parallel plates electrostatic