SJT 11171-1998 无金属化孔单双面碳膜印制板规范.pdfVIP

ICs 31.180 L 30 备案号:2074-1998 Smi 中华人民共和国电子行业标准 SJ/T 11171一1998 m o 无金属化孔单双面碳膜印制板规范 c . Specification for single and double sided w carbon-coated printed boards without interlayer connection x f z b w. w w 1998-03-11发布 1998-05-01实施 中华人民共和国电子工业部 发布 目 次 前言 1 范围 ·····，，，···········，，，，·，·······，···，1·，，·····】·，·，···，·····，，·········，·，，·…… (1) 2引用标准··，·················································································……(1) 3定义 ·················，、，·····，，······························，·····，·············，···············…… (2) 4要求 ····，，·，··············，，·，······，···甲，·········，，·，甲，········-····，·1·1(2) 5试验方法 ···················，··················，······，·········，，···························…… (7) 6检验方法 ····，·，························‘，·，·······································，········……(10) m 7标志、包装、运输和贮存··，·······································，························……(13) o c w. x f z b w. w w