交变电流对60nm厚纳米晶铜互连线变形失效行为的影响.pdfVIP

24 2 Vol.24 No.2 2 0 1 0 4 CHINESE JOURNAL OF MATERIALS RESEARCH April 2 0 1 0 60 nm ∗ ( 710049) , – , , 2 (j 10 MA/cm ) , 2 (j 10 MA/cm ) , , , , , TG111 1005-3093(2010)02-0129-08 The Effects of Alternating Current on Deformation and Failure of 60 nm–thick Nanocrystalline Cu Lines ZHANG Jinyu ZHAO Yi LIU Gang∗∗ ZHANG Jing SUN Jun (State Key Laboratory for Mechanical Behavior of Materials, Xi an Jiaotong University, Xi an 710049 ) * Supported by the National Basic Research Program of China No.2010CB631003 and the National Natural Science Foundation of China No Manuscript received December 17, 2009, in revised form January 15, 2010. ** To whom correspondence should be addressed, Tel:(029 E–mail: lgsammer@mail.xjtu.edu.cn ABSTRACT In this paper, the thermal fatigue properties of small scale copper structures on silicon substrate under cyclic thermo–mechanical loads introduced by alternating current have been investigated by in situ observation the evolution of fatigue damage. The effects of alternating current (AC) on the deformation and failure behavior of 60–nm–thick nanocrystalline (NC) Cu lines were studied. Experimental results revealed the current–density dependent failure mechanism of NC Cu lines. Under low current density condition, the failure process was dominated by stress controlled fatigue mechanism of grain extrusion. Under high current density condition, however, the