Ag3Sn粗化模型及其对Sn-Ag-Cu焊料蠕变影响.pdfVIP

45 8 Vol.45 No.8 2009 8 912—918 ACTA METALLURGICA SINICA Aug. 2009 pp.912–918 Ag Sn Sn–Ag–Cu ∗ 3   1)  1)   1)    1,2) 1) () , 110016 2) Department of Materials Science and Engineering, University of Illinois at Urbana–Champaign, Urbana, IL61801, USA , , Sn–Ag–Cu(SAC) Ag Sn 3 . Æ: β–Sn Ag Sn . Lifshitz–Wagner 3 , , . , , TB302.3, TB303 A 0412−1961(2009)08−0912−07 MODELING OF Ag Sn COARSENING AND ITS EFFECT 3 ON CREEP IN Sn–Ag–Cu SOLDER WANG Xiaojing 1), ZHU Qingsheng 1), WANG Zhongguang 1), SHANG Jianku 1,2) 1) Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 2) Department of Materials Science and Engineering, University of Illinois at Urbana–Champaign, Urbana, IL61801, USA Correspondent: WANG Zhongguang, professor, Tel: (024 E-mail: zhgwang@imr.ac.cn Supported by National Basic Research Program of China (No.2004CB619306) Manuscript received 2009–02–27, in revised form 2009–04–14 ABSTRACT Coarsening of the microstructure in Sn–Ag–Cu (SAC) solder joints under current stressing was observed experimentally and modeled by a dislocation–creep model which incorporates the coarsening of second phase particles in lead–free solder alloys. Both the effects of electric current and strain–enhanced coarsening were considered in this model. The straining effect took into account of both the inelastic–strain history and hydrostatic constraint. The model describes well the evolution of the eutectic microstructure and the predictions of the model agre