咪唑对钌化学机械抛光影响_王婕.pdfVIP

咪唑对钌化学机械抛光的影响* 王 婕，储向峰，董永平 ，孙文起 ，叶明富 ，白林山 （安徽工业大学 化学与化工学院，安徽 马鞍山 243002） 摘要：利用自制的抛光液，研究了在磷酸体系抛光液中咪唑（imidazole ，C H N ）浓度和pH 值对钌的抛光速率的 3 4 2 影响。采用电化学分析方法和 X 射线光电子能谱仪(XPS)分析了缓蚀剂咪唑对腐蚀效果的影响；采用原子力显微镜 （AFM ）观察钌片表面的微观形貌。试验结果发现，金属钌在未加入咪唑的磷酸体系抛光液中，抛光速率最高为6.2 nm/min ，平均粗糙度 （Ra）为10.7 nm；而在抛光液中加入咪唑后，钌的抛光速率为3.9 nm/min ，平均粗糙度 （Ra） 降至1.0 nm。咪唑的加入，虽然降低了金属钌的抛光速率，但提高了金属钌的表面质量。同时，也促进了金属钌表 面钝化膜的生成，降低了金属钌的腐蚀电流值，抑制了阴极反应。 关键词：钌；咪唑；化学机械抛光；电化学检测 中图分类号：TG175.3 文献标识码：A Effect of Imidazole in the Chemical Mechanical Planarization of Ruthenium 1 WANG Jie, CHU Xiang-feng , DONG Yong-ping, SUN Wen-qi, YE Ming-fu, BAI Lin-shan (School of Chemistry and Chemical Engineering, Anhui University of Technology, Ma’anshan 243002, China) Abstract ：The effect of imidazole (C H N ) concentration and pH value on the material removal rate (MRR) in H PO 3 4 2 3 4 slurries was investigated. The effect of inhibiter on the corrosion behavior was investigated by electrochemical methods and X-ray photoelectron spectroscopy (XPS). The surface roughness of the polished Ru disk was characterized by atomic force microscopy (AFM). The results show that the MRR can attain 6.2 nm/min and the surface roughness (Ra) of the polished Ru disk can reach 10.7 nm when Ru in the H PO slurries without imidazole. After adding imidazole into the slurries, the MRR for 3 4 Ru CMP can reach 3.9 nm/min and the roughness Ra decreased to 1.0 nm. Imidazole can reduce the MRR of Ru, and obtain better surface quality. Polarization curves suggest that imidazole can promote the