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- 约1.02万字
- 约 9页
- 2017-08-31 发布于安徽
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化学镀技术的发展过程与应用
周崎, 张震坤
(广东检验检疫局技术中心,广州,510623)
摘要:本文回顾了化学镀的发展过程和研究现状,重点分析了化学镀镍在工程和电子工业中的应用,最后讨论了化学镀的研究趋势。
关键词:化学镀,发展过程,工程,电子工业,应用
Development and Application of Chemical Plating
Zhou Qi, Zhang Zhengkun
(Guangdong Inspect and Quarantine Bureau Technique Centre,Guangzhou,510623)
Abstract: This text recall the development of this chemical plating process and the status quo of study , focus on analysis of the chemical plating nickel in the application of engineering and electronic industries, discuss trends in chemical plating at last.
Keywords: chemical composition plating,development ,engineering
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