超粗化前处理改善沉锡板阻焊剥离.pdfVIP

超粗化前处理工艺改善沉锡板阻焊剥离 （深圳市板明科技有限公司 518067）孙世铭 王扩军 谢锡忠 摘 要 介绍了一种铜面化学处理方法——超粗化前处理工艺，该工艺对铜面进行微蚀粗化处 理后，铜表面呈蜂窝状，显著增大铜箔表面积，可用于PCB 阻焊绿油前处理。在PCB 阻焊绿油前 处理中，采用常规前处理方法（如火山灰pumice 磨板或过硫酸盐化学微蚀）处理后，由于铜面 粗化程度不够，导致油墨与铜结合不佳，无法抵抗高温及药水的侵蚀，化学镀镍/浸金和化学沉 锡完成后阻焊油墨剥离常有发生。调整阻焊制作工艺参数，试用不同阻焊油墨等常规工艺改善均 无法彻底解决阻油墨焊剥离问题。应用超粗化作前处理，可增加铜面与阻焊油墨结合力，确保结 合部位在后工序中不易受药水侵蚀，从而可以有效的解决沉锡和化学镀镍/浸金板阻焊剥离的问 题。 关键词 前处理 超粗化 阻焊剥离 沉锡 化学镀镍/浸金 Super Roughening Process Improves Solder Mask Peeling of Immersion Tin Shenzhen Boardtech Co., Ltd. Abstract This paper introduces BTH-2085 Super Roughening Process which is a novel pretreatment process. Pretreated by this process, an alveolate copper surface can be achieved, which can remarkably enlarge the copper surface area. This process specially suits for solder mask (SM) pretreatment. If adopts the traditional pretreatment such as pumice scrubbing and persulphate micro-etch pretreatment, copper surface can’t be roughed enough that adhesive ability between copper and solder mask may be poor. Sold Mask will be attacked by high temperature and chemicals, so solder mask peeling becomes a common problem after Immersion Tin and Electroless Nickel Immersion Gold ( ENIG). Common improving methods such as adjusting process parameters and trying different SM can’t solve this problem completely. Super Roughening Process pretreatment can improve the copper-SM adhesion and decreased SM peeled off. Therefore, SM peeling can be prevented effectively Key words Pretreatment Super Roughening Sold Mask Peeling Immersion Tin ENIG （Electroless Nickel Immersion Gold ） 1 前言 无铅时代的到来，PCB 的表面涂覆方式中沉锡（Immersion Tin）和化学镀镍/浸金（ENIG） 的应用也越来越多，由于化学镀镍/浸金和化学沉锡药水对阻焊油墨的侵蚀，表面处理完成后阻 焊油墨剥离（俗称“甩油”）也常有发生，而沉锡药水由于硫脲的存在，阻焊剥离就更为严重 了。调整阻焊制作工艺参数，试用不同阻焊油墨等常规工艺改善均无法彻底解决阻油墨焊剥离问 题。在此种情况下，本文介绍了板明科技公司的BTH-2085 超粗化前处理工艺，该工艺对铜面进 行极度粗化，提高铜面和阻焊油墨结合力，确保结合部位油墨在后工序中不易受药水侵蚀，从而 可