Durostone波峰焊原料.docVIP

DUROSTONE CAG Electrostatic Dissipative Solder Pallet Composite Durostone( CAG762 material is designed specifically to meet the soldering requirements of printed circuit board assemblers utilizing tin wave solder, vapor phase or infra-red reflow equipment. Durostone( CAG762 is the optically sensitive version of our ESD grade material. Durostone( CAG762 has a surface resistant to solder adhesion, solvents and cleaning agents. In addition the material is easier to handle in production than metal fixtures because of its lighter weight and lower thermal conductivity. Typical properties of the composite include: Color Light Green / Grey Density 1.85 g/cm cubed Water Absorption 0.2% Surface Resistivity 105–108 ohms Thermal Conductivity .25 W/moK Flexural Strength ┴ (3 point support) 360 MPa Coefficient of Linear Expansion 11 10-6/K (between 30o 200o C) Maximum Operating Temperature (10-20 sec) 350o C Continuous Operating Temperature 260o C Modulus of Elasticity 18,000 MPa Specific Heat Capacity 930 J/kgoK Barcol Hardness 80 Symbol: ┴ perpendicular to laminations Thickness Tolerances Parallelism 3-12 mm +/- .10 mm (thickness) ± .10 mm +/- .10 mm (flatness per 300 mm squared) ± .08 mm All information and recommendations regarding properties and applications are based upon tests and data believed accurate. Any particular application is the sole responsibility of the user. No warranty is expressed or implied. Under no circumstances shall we be liable for incidental or consequential loss.