【学习整理】代尔夫特理工的光刻工艺技术.ppt

Applied Lithography What is photolithography? Temporarily coat photoresist on wafer Transfers designed pattern to photoresist Most important process in IC fabrication 40 to 50% total wafer process time Determines the minimum feature size Lithography Lithographic Processing: Wafers Essential Lithography Steps Coat wafer with photo resist Expose resist to a pattern Develop resist Bake resist to withstand subsequent etch process. Film growth/deposition Photoresist Spinning Masking and Exposure Developing the Pattern Etch the Material Repeat Process Final Release Double-exposure Patterning Immersion Lithography Electron Beam Lithography Photoresist Spin Coater Photoresist Applying Photoresist Suck Back Photoresist Spin Coating Photoresist Spin Coating Photoresist Spin Coating Photoresist Spin Coating Photoresist Spin Coating Photoresist Spin Coating Photoresist Spin Coating Photoresist Spin Coating Photoresist Spin Coating Edge Bead Removal Edge Bead Removal Optical Edge Bead Removal Exposure Relationship of Photoresist Thickness to Spin Rate and Viscosity Viscosity Fluids stick on the solid surface Affect PR thickness in spin coating Related to PR type and temperature Need high spin rate for uniform coating Soft Lithography Process In soft lithography, an elastomeric stamp with patterned relief structures on its surface is used to generate patterns and structures with feature size ranging form 30 nm to 100 mm. Elastomeric polydimethylsiloxane (PDMS) is most widely used. Other materials include polyurethanes, polyimides, and cross linked phenol formaldehyde polymers Microcontact Printing (mCP). An ink of alkanethiols is spread on a patterned PDMS stamp. The stamp is then brought into contact with the substrate. The thiol ink is transferred to the substrate where it forms a self-assembled monolayer that can act as a resist against etching, or as the carrier for chemical/biological functionality. Features as small as 300 nm have been made in this way. Figure 1: Sch