损伤层厚度有限元分析阅读重要.pdfVIP

———　　 孟剑峰　葛培琪　李剑峰　刘家富 山东大学, 济南,250061 :根据测量的锯切力, 求出线锯圆周上不 位置处磨粒所受力。将多个磨粒产生的法向力及切 向力作用于三维有限元模型, 考虑多磨粒的耦合作用, 分析切割区的应力场, 从而提出了硅晶体线锯切 片的损伤层厚度分析模型, 实验验证了该模型的正确性。该模型克服了损伤层厚度实验耗资大、费时、 损害工件等缺点。 时分析得出, 在恒压力进给条件下, 随着线锯速度的增加, 损伤层厚度略有减小。 :;;; :TH 161 　　　:1004—132X(2007)10 —1189—04 Finite Element Analysis of the Damage Thickness in Wiresaw Slicing Silicon Meng Jianfeng 　Ge Peiqi 　Li Jianfeng 　Liu Jiafu Shandong U ni ersity, Jinan, 250061 Abstract:Based on the measured forces, the forces acting on single diamond grain were calculat- ed. The three - dimensional finite element model w as built up, which considered the coupling effect of forces on multi - grains. The stress states of cutting area were analyzed using finite element method, and then the damage thickness w as determined. This model w as erified by experimental results. The model o ercomes the shortcomings of high cost, time consuming and damage the w orkpiece in damage thickness test . It is show n that as feed force is a constant, the damage thickness decreases slightly with the increase of w ire speed. Key words:silicon;wiresaw slicing ;damage thickness;finite element analy sis 0　引言 。 90 %, , 。, : 。 →→→→→→ , 。, ,, , 。 。, 1　线锯圆周上任意位置单 个磨粒的受力 , , 分析 ,。 、、、 　　1 , , , vs , vw 。, 。 θ, [1] [2] Pei θ。 。 , , ,, 。 , ,, [3,4] 。