电子封装材料过共晶硅-铝合金的组织特征和热性能（英文）.pdfVIP

Transactionsof NonferrousM etals 黉 Avai：albj·leon，Slniceaite、nn^n^c^fs．ecDeinceirdreiecctct．om SocietyofChina Trans．NonferrousMet．Soc．China22(2012)1412—1417 www ．tnm sc．cn Microstructurecharacterizationandthermalpropertiesof hypereutecticSi_Alalloyforelectronicpackagingapplications YUKun，LIShao-jun，CHENLi．san2，ZHAOWei．shang，LIPeng—fei。 1．SchoolofMaterialsScienceandEngineering，CentralSouthUniversity,Changsha410083，China； 2．ZhuzhouSmelterGroupCo．，Ltd．，Zhuzhou412004，China Received7June2011；accepted25October2011 Abstract：Therapidsolidifiedprocessandhotpressmethodwereperformedtoproducehtreehypereutectic55％S卜A1．7O％Si-Al and90％S卜A1alloysforheatdissipationmaterials．Theresultsshow thattheatomizationisaneffectiverapidsolidifiedmethodto producetheSi—AlalloyandthesizeofatomizedSi-Alalloypowderislessthan50gm．TherapidsolidifiedSi—Alalloypowder werehotpressedat550。Cwiththepressureof700MPatoobtainhterelativedensitiesof99．4％．99．2％ and94．4％ for55％Si—A1． 70％Si-AIand90％Si-Alalloys．respectively．Thetypica1physicalproperties．such asthethermalconductivity,coemcientof thermalexpansion(CTE)andelectricalconductivityofrapidsolidifiedSi-Alalloysareacceptableasaheatdissipationmaterialfor manysemiconductordevices．The55％Si—Alalloychangesgreatly(CTE)withtheincreaseoftemperaturebutobtainsagood therlnalconductiviyt．TheCTEOf90％Si—Alalloymatcheswiththesiliconverywellbutitsthermalconductiviyt valueislessthan 1O0W ／(mK·1．Thereofre．the7O％Si-A1alloypossesseshtebestcomprehensiveprope~iesofCTEandthermalconductivityofrusing astheheatsinkmaterials． Keywords：Si-Alalloy；rapidsolidi