5甲基苯并三氮唑作为电腐蚀抑制剂在铜电化学机械平坦化中的应用(英文期刊).pdfVIP

Trans. Nonferrous Met. Soc. China 23(2013) 2431−2438 5-methyl-1H-benzotriazole as potential corrosion inhibitor for electrochemical-mechanical planarization of copper Yan-fei BIAN, Wen-jie ZHAI, Bao-quan ZHU School of Mechatronics Engineering, Harbin Institute of Technology, Harbin 150001, China Received 4 July 2012; accepted 18 February 2013 Abstract: According to the electrochemical analysis, the corrosion inhibition efficiency of 5-methyl-1H-benzotriazole (m-BTA) is higher than that of benzotrizaole (BTA). The inhibition capability of the m-BTA passive film formed in hydroxyethylidenediphosphonic acid (HEDP) electrolyte containing both m-BTA and chloride ions is superior to that formed in m-BTA-alone electrolyte, even at a high anodic potential. The results of electrical impedance spectroscopy, nano-scratch experiments and energy dispersive analysis of X-ray (EDAX) indicate that the enhancement of m-BTA inhibition capability may be due to the increasing thickness of passive film. Furthermore, X-ray photoelectron spectrometry (XPS) analysis indicates that the increase in passive film thickness can be attributed to the incorporation of Cl− into the m-BTA passive film and the formation of [Cu(I)Cl(m-BTA)]n polymer film on Cu surface. Therefore, the introduction of Cl− into m-BTA-containing HEDP electrolyte is effective to enhance the passivation capability of m-BTA passive film, thus extending the operating potential window. Key words: electrochemical-mechanical planarization; 5-methyl-1H-benzotriazole; corrosion inhibitor; chloride ion