硫代硫酸盐无氰镀银工艺及银镀层微观组织分析.pdfVIP

Trans. Nonferrous Met. Soc. China 23(2013) 3822−3828 Cyanide-free silver electroplating process in thiosulfate bath and microstructure analysis of Ag coatings 1 1 2 3 1 Feng-zhang REN , Li-tao YIN , Shan-shan WANG , A. A. VOLINSKY , Bao-hong TIAN 1. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, China; 2. Luoyang Bearing Science and Technology Corporation Limited, Luoyang 471039, China; 3. Department of Mechanical Engineering, University of South Florida, Tampa’ FL 33620, USA Received 29 October 2012; accepted 23 December 2012 Abstract: Cyanide-free silver electroplating was conducted in thiosulfate baths containing AgNO and AgBr major salts, respectively. 3 The effects of major salt content and current density on surface quality, deposition rate and microhardness of Ag coatings were investigated. The optimized electroplating parameters were established. The adhesion strength of Ag coating on Cu substrate was evaluated and the grain size of Ag coating was measured under optimized electroplating parameters. The optimized AgNO3 content is 2 40 g/L with current density of 0.25 A/dm . The deposited bright, smooth, and well adhered Ag coating had nanocrystalline grains 2 with mean size of 35 nm. The optimized AgBr content was 30 g/L with current density of 0.20 A/dm