双面抛光机原理及结构(英文版).doc

The Development of the Precise Double Sided Polishing Machine Keywords: double sided polishing, photoelectron material, ultra-smooth surface Abstract. The functional materials such as sapphire, silicon wafer etc. are processed efficiently with ultra-smooth surface for the demand of the rapid development of the IC industry. The precise double sided polishing process is one of the main methods of getting the ultra-smooth surface for these materials. This paper introduces the structure and characteristic of the precise double sided polishing machine with a precise pressure control system equipped a new type electro-pneumatic digital servo valve. The works, such as machine design, development of the control system and optimization of process parameters etc. are carried out to meet the requirement of the precise double sided polishing machining process. This equipment has the characteristic of high machining precision and precise control capability, so it can be applied to the ultra-precise machining of the ultra-thin sapphire, silicon wafers etc. Introduction The ultra-smooth and flat surface on both sides of silicon and sapphire wafers can be got by double sided polishing process simultaneously and invariably, due to the workpiece runs in a complex motion in the carrier driven by the top and bottom polishing pads over the workpiece surface. This complex motion is intended to produce a homogenous polishing texture on the workpiece surface. Therefore, the polishing machine should has some characteristics , such as 1) powerful driving system and stronger structure, due to the big friction force between the workpiece and the pads; 2) smooth running and steady loading process to protect the ultra-thin wafers to be broken; 3) heat proof ability to avoid the thermal distortion of the machine body. A precise double sided polishing machine was developed based on the study about the machine design, loading and speeding control system with the software and hardware design, also