[维智电通]不同热界面材料在不同应用下的有效热管理.pdfVIP

Effective Thermal Management with Different Thermal Interface Materials for Different Applicatio Kevin Chung, Ph.D., AI Technology, Inc. 70 Washington Road, Princeton Junction, New Jersey, 08550, USA INTRODUCTION: Proper and effective thermal management and heat dissipation for electronic devices from computers to LED lighting to solar panels are critical for its performance and reliability1 2 . Thermal conductivity of a thermal interface adhesive or compound is commonly used as a “gauge” of how good it may be in helping to dissipate heat from a device. This should not be the only measure for the potential effectiveness as a thermal interface for different application conditions and requirements. Various applications and requirements need to include at least the following: 1. Whether the interface must also serve as a mechanical fastener (i.e. adhesive). If yes, a. How large is the bonding area? Bonding areas larger than a square centimeter will require a more flexible adhesive. b. Are the coefficients of thermal expansion (CTE) on the device and the heat-sink different? This is true with the CTE of silicon (3ppm/°C) and aluminum (23 ppm/°C) or copper (18ppm/°C). Using these materials the adhesive should be more flexible to absorb different shear stress and interfacial peel. c. Is the expected operational temperature higher than a commercial specification of 85°C or above the military scale of 150°C? d. Is the expected operational temperature expected to be lower than usual, - 20°C or -55°C? Again, lower temperature will induce proportionally higher internal and interfacial stresses that are best accommodated with more flexible