Comparison of Wettability for Sn-Based Solders on Copper and Aluminum Substrates.pdfVIP

Materials Science Forum Vol. 687 (2011) pp 15-20 Online available since 2011/Jun/10 at © (2011) Trans Tech Publications, Switzerland doi:10.4028//MSF.687.15 Comparison of Wettability for Sn-based Solders on Copper and Aluminum Substrates Limeng Yin1, a*, Jianwei Xian2, b and Zongxiang Yao1, c 1School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, Chongqing 401331, China 2School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, China *a b c email: yeenlm@163.com, email: xian.jianwei@, email: yaozongx@163.com Key words: Sn-based solder; Wettability; Wetting balance method; Aluminum substrate. Abstract. The wetting properties of four typical Sn-based solders, i.e., Sn-37Pb, Sn-3.0Ag-0.5Cu, Sn-0.7Cu and Sn-9Zn, on copper (Cu) and aluminum (Al) substrates at 250 ℃, 260 ℃ and 270 ℃ were evaluated and compared by wetting balance method. The experimental results show that the wetting time of all solders on Cu substrate is shorter than that on Al substrate, but the wetting force of the solders with Cu substrate is bigger than that with Al substrate except Sn-9Zn solder. In addition, the wettability of the solders on Al substrate increases with increasing soldering temperature, and the wetting force of Sn-9Zn increases most obviously among four solders and reach 3.68 mN at 270 ℃. The results also show that the wettability of the solders on Cu substrate mainly depends on surface tension of solder alloy, however, it depends on both surface tension and interaction with Al on Al substrate. Due to the active element Zn riches on the surface of S