《EOS_ESD_EER》.docVIP

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《EOS_ESD_EER》.doc

Common causes of OES / ESD failures in Microprocessors. Electro Static Discharge (ESD). ESD can damage a Microprocessor in a number of ways, some of which are outlined here. ESD from People handling Processors while not exercising proper ESD controls (Using Ground straps, Heel straps, ESD smocks etc). By simply walking around (particularly on carpets), sitting on an office chair for example, the human body will develop a static electric charge anywhere from 10Kv to approx 60Kv. Dry atmospheres with low humidity will allow a person to develop a higher charge. Example being the “shock” we experience getting out of a car on a hot summer day. An Electro static discharge can only be felt if the charge exceeds 30Kv. In the case of an audible discharge the charge required is typically in excess of 60Kv. Microprocessors can be damaged by an ESD event where the charge is as small as 5 to 10Kv (This applies to most modern electronic devices). Where charges this small are involved, a person can destroy a component without being aware of it. ESD Smocks, Ground straps, heel straps, ESD safe packaging (Static bags) etc. dissipate any charges that may build up on a person. When used correctly these ESD precautions will protect Microprocessors and any other electronic components from ESD damage. ESD from incorrectly grounded workbenches. Static electricity can build up on a workbench as a result of friction. If benches, conveyors etc are not correctly grounded, they may develop a sufficient charge to damage / destroy any components placed on them. All workbenches (including bench top mats) should be grounded. ESD from materials such as plastics, which are not ESD safe. Items such as plastic bags, polystyrene cups, plastic cups can all build up a large static charge, these items should never be left on a workbench where electronic components are out of ESD safe packaging. Electrical Over-Stress (EOS). EOS can damage a Microprocessor in a number of ways, some of which are outlined h

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