《BGA Sing Tooling SPEC》.pdf

Advanced Semiconductor Spec. No.:64-31-4950-0069 Engineering, INC. Version: B 26, Chin 3rd Rd. Date: JUL. 25, 2007 Nantze Export Processing Zone Issue: CSH Chen BGA SINGULATION TOOLKIT REQUIREMENT FUNCTIONAL PURCHASE SPECIFICATION. BGA 1 1 PURPOSE Establish the purchasing requirement for BGA singulation too Conversion Kit. 立BGA 2 SCOPE Purchasing requirement for new tool new product. 3 DEFINITION 3.1 Specification for BGA singulation tool equipment . BGA 3.2 Buyoff criteria of bga singulation tool equipment. BGA 4 RESPONSIBILITY 4.1 /行 5 REFERENCE DOCUMENTS 參 5.1 Equipment purchase guideline 5.2 ESD control document 6 SAFETY 2 7. MATERIAL / EQUIPMENT / TOOL 料 / / PROJECTOR MICROSCOPE 8. PROCEDURE Nameitem of main equipment BGA singulation tool equipment BGA Purchase main item specification 8.2.1. General specification 8.2.1.1 Pin 1 is toward operator. 8.2.1.2 Tooling must utilize substrate outline and slot hole to locate substrate. SLOT HOLE 8.2.1.3 The tooling shall be compactly designed and must be easily mounted and dismounted from the machine. 易 8.2.1.4 Miss-feed mechanism must be highly sensitive to avoding damaging to molded strip and die. 料靈 , 零 3 8.2.1.5 Access for vacuum must be large enough to remove dirt , debris , dust , mold flashes and metal slugs effectively. 切 8.2.1.6 Vacuum failure detector