《08 fundamentals of multichip packaging》.pdfVIP

Source: FUNDAMENTALS OF MICROSYSTEMS PACKAGING C H A P T E R 8 FUNDAMENTALS OF MULTICHIP PACKAGING Prof. Harry K. Charles Jr. Johns Hopkins University Prof. Rao R. Tummala Georgia Institute of Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Design Environment g n i C g I a k c a Thermal Management P Materials Single Chip Opto and RF