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White Paper
Method of Modeling Differential Vias
Issue: 1.0
Date: April 8, 2010
Lambert Simonovich,
Signal Integrity Backplane Specialist,
Lamsim Enterprises Inc.,
lsimonovich@
Dr. Eric Bogatin,
Signal Integrity Evangelist,
Bogatin Enterprises,
eric@beTheS
Dr. Yazi Cao,
Postdoctoral Fellow,
Dept. of Electronics, Carleton University,
yazi.cao@
Abstract
Accurate, models for vias in a multilayer circuit board are necessary to predict
link performance in the GHz regime. This paper describes a methodology to build
a high bandwidth, scalable first
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