Reliability modeling on a MOSFET power package based on embedded die technology教材.pdfVIP

Microelectronics Reliability 50 (2010) 923–927 Contents lists available at ScienceDirect Microelectronics Reliability journal homepage: www.elsevi /locate/microrel Reliability modeling on a MOSFET power package based on embedded die technology Daoguo Yang a,b,*, Martien Kengen b, W.G.M. Peels b, David Heyes b, W.D. van Driel b a Guilin University of Electronics Tec