DFG841技术规范.docVIP

DFG841 磨片设备技术规范指标 features 1)For wafer ..φ8 .. It is possible to grind to the wafer of maximum φ8 in consideration of the large caliber of the wafer in recent years. 2)Fine finish of grinding side roughness Ra 0.01μm or less is possible. Past [sa-fe] according to the wheel technology and a high rigidity and the superprecision machine technology of the disco lasting for half a century. Fine finish that exceeds the common sense of [isukurainta] has been achieved. 3)Automatic management making by in-process measurement about grinding thickness The work thickness under