DesignofHeatSinks--II.ppt

Multi Dimensional Steady State Heat Conduction P M V Subbarao Associate Professor Mechanical Engineering Department IIT Delhi Heat treatment of Metal bars rods Heat Flow in Complex Geometries (Casting Process) Microarchitecture of Pentium 4 Thermal Optimization of Microarchitecture of an IC Microprocessor power densities escalating rapidly as technology scales below 100nm level. There is an urgent need for developing innovative cooling solutions. The concept of power-density aware thermal floor planning is a recent method to reduce maximum on-chip temperature. A careful arrangement of components at the architecture level, the average reduction in peak temperature of 15°C. A tool namely, Architectural-Level Power Simulator (ALPS), allowed the Pentium 4 processor team to profile power consumption at any hierarchical level from an individual FUB to the full chip. The ALPS allowed power profiling of everything, from a simple micro-benchmark written in assembler code, to application-level execution traces gathered on real systems. At the most abstract level, the ALPS methodology consists of combining an energy cost associated with performing a given function with an estimate of the number of times that the specific function is executed. The energy cost is dependent on the design of the product, while the frequency of occurrence for each event is dependent on both the product design and the workload of interest. Once these two pieces of data are available, generating a power estimate is simple: multiply the energy cost for an operation (function) by the number of occurrences of that function, sum over all functions that a design performs, and then divide by the total amount of time required to execute the workload of interest. Need for Thermal Optimization Thermal Management Mechanism in Pentium 4 The Pentium 4 processor implements mechanisms to measure temperature accurately using the thermal sensor. In the case of a microprocessor, the power consumed is a fun