Stress function description.pptVIP

Confidential Trust,Hardwork, Warmth Simon Zhao Stress Function Description Theory introduce Tool overview calibration Stress Introduction Stress = Force / Area Film stress will cause wafer bending Shown below is Tensile Stress No stress Stress required to stretch film “Deposit” stretched film Wafer will deform due to the stress Film Stress on a Wafer Si Substrate Compressive Stress Forces act in the plane of the film Bending of the substrate due to the film Characterized by the Biaxial Elastic Modulus of the substrate Theory introduce s = stress t = thickness [substrate (s) or film (f)] R = radius of curvature [before (s) or after (f) film is deposited] s = average wafer stress E / (1 - n) = biaxial elastic modulus of the substrate Theory introduce Theory introduce Tencor FLX-5500 (Tencor FLX-5510)具有每小时能检测超过55片Wafer的能力，准备时间短和在200mm的直径内能实现自动检测薄膜应力的特点。Tencor FLX-5500 (Tencor FLX-5510)能够检测所有类型的标准膜，包括metals, polymers还包括普通的dielectrics和passivations KT FLX-5510 Function Tencor FLX-5500 (Tencor FLX-5510)是Tencor专利技术-双波长技术的增强型。两束激光同时测量薄膜的应力，并抵消薄膜反射特性有可能产生的干扰。对不同的薄膜，系统能自动选择Laser以得到最好的信号。如果有必要的话，Tencor FLX-5500 (Tencor FLX-5510)能选择两组Laser信号(INFR: 670nm and RED: 980nm)，以得到最佳的测量结果。 KT FLX-5510 Function KT FLX-5510 Function KT FLX-5510 Function FSM 900TC Function The system uses a vacuum annealing chamber based upon a cold wall, rapid thermal processing (RTP) type chamber. The system can incorporate multiple metrology probes for data collection during a temperature cycle, including stress hysteresis, thermal desorption spectroscopy (TDS), film shrinkage (thickness change), reflectivity and in-situ sheet resistivity. FSM 900TC Function FSM 900TC Function Detector Z,X laser interlock Z,X movement Common,Z hard stop, X hard stop,810 and 750 signal KT FLX-5510 hand-off calibration 进入C:\hs\ghspi.bat KT FLX-5510 hand-off calibration 进入后，按ESC 键 KT FLX-5510 hand-off calibration 选择“Skip Handler init” 选择“Data Transfer”?“Upload from Handler”.这个动作是将Handler的三个位置的初始坐标下载到这个软件中，不做这个动作，接下来的