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A Novel Manufacturing Technology for RF MEMS Devices on Ceramic Substrates.pdf
Hindawi Publishing Corporation
Journal of Sensors
Volume 2010, Article ID 625325, 6 pages
doi:10.1155/2010/625325
Research Article
A Novel Manufacturing Technology for RF MEMS Devices on
Ceramic Substrates
V. Schirosi, G. Del Re, L. Ferrari, P. Caliandro, L. Rizzi, and G. Melone
Microelectronic Research, OPTEL InP Consortium Microelectronic Research Lab, c/o Cittadella della Ricerca,
S.S. 7 Km 7.3, 72100 Brindisi, Italy
Correspondence should be addressed to V. Schirosi, v.schirosi@optel.it
Received 12 July 2010; Accepted 7 November 2010
Academic Editor: P. Siciliano
Copyright © 2010 V. Schirosi et al. This is an open access article distributed under the Creative Commons Attribution License,
which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Microelectromechanical systems are often used for their enormous capability and good qualities in T/R modules especially for
space modular applications. High isolation and very low insertion loss are guaranteed by their intrinsic working principle. This is
a very robust, flexible, and low-cost technology, and it provides high reliability, good reproducibility, and complete fulfillment of
technical requirements.
1. Introduction etc.) for phase and amplitude modulation which are essential
components of TX/RX modules [1, 2].
The exploitation of MEMS technology for RF applications
enables the manufacturing of high-performance and low- 2. RF MEMS Design
cost lumped components like variable capacitors, inductors,
and switches. Starting from these elements, the imple- The RF MEMS devices described have been full designed,
mentatio
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