PCB图形转移要点.pptVIP

内层Open/Short的主要问题种类: 内层开路 (I/L Open) 1. 内层短路 (I/L Short) 类型 (Type) 1. 2. 3. 6. 4. 5. 7. 9. 8. 10. 11. 2. 3. 4. 5. 板料凹痕 (Dents on laminate) 曝光垃圾 (Exposure dirt) 板料擦花 (Scratch on laminate) 干膜下垃圾 (Dirt under dry film) 曝光走光 (Over exposure） 擦花菲林 (Scratch on GII) 起保护膜 (Mylar peel off) 蚀刻过度 (Over-etching) 擦花铜面(Poor handling after etching) 铜面氧化 (Cu surface oxide) 干膜起皱 (Folded dry film) 板料污渍 (Resin dust) 干膜起皱 (Folded dry film) 干膜盖板边 (Dry film over-lamination) 干膜胶渣 (Dry film scum) 风刀/压水辘垃圾 (Dirt air knife/roller) 类型 (Type) 擦花干膜(Scratch on dry film) 6. 显影不净（Under-developing) 7. 六、常见问题种类及特征 内层Open/Short图例