Bonding SeqChinese解读.pptVIP

* 壓焊工序 行程 1: 焊頭在打火高度( 復位位置 ) Stage 1: Bond Head at the Fire Level Position 線夾 ‘關閉’ – Wire Clamp closes 空氣中的金球Free Air Ball 劈刀 - Capillary *打火要求: 準確和對稱的金球 Accurate and Symmetrical FAB must be formed. IV) 燒球不好可能存在的問題: Potential failure if FAB formed is not proper : I) 打扁金球 - Smash Ball II) 高爾夫球或叫匙球 - Golf or Club Ball III) 不黏 - Non sticking IV) 起坑: 因劈刀直接打在焊壓點 - Cratering due to Cap direct impact to the bond pad(cap mark) 行程 2: 焊頭由打火高度下降到第一焊點搜索高度 Stage 2: Descending From Fire Level to 1ST Bond Search Height Position Die 線夾 ‘打開’ – Wire Clamp Open 焊頭在向下運動的過程中, 金球通過空氣張力器的空氣張力, 使金球緊貼劈刀凹槽 FAB Capture Within The Chamfer Diameter of Capillary During Descending Motion, FAB Pull Upwards by Air Tensioner 在第一焊點搜索高度開始, 焊頭使用固定的速度搜索接觸高度 At Search Height Position Bond Head Switch to Constant Speed(Search Speed) to Search For Contact 第一焊點搜索速度1st Search Speed 1 第一焊點搜索高度1st Search Height 行程 3: 接觸高度和壓焊工藝; 第一焊點參數 Stage 3: Touch Down and Bonding Process; 1st Bond Parameter 最初的球形影響參數: 碰撞壓力和預備功率 Impact Force and Standby Power DIE 線夾“打開” - Wire Clamp “Open” 最終的球形和質量決定于: FINAL BALL SHAPE AND QUALITY IS DETERMINE: 1ST BOND CONTACT TIME CONTACT POWER, CONTACT FORCE, BASE TIME BASE POWER BASE FORCE 線夾 ‘打開’ 行程 4: 共晶金屬的形成 Stage 4: Intermetallic Formation 超聲功率 Ultrasonic Power 共晶金屬的生長Intermetallic Growth DIE 共晶金屬的覆蓋範圍 Intermetallic Coverage 第一焊點的功率和壓力變量曲線簡圖 1st Bong Power and Force Profile Release Force Main Intermetallic Formation Region Die Die Die Ball Size, Ball Thickness and Intermetallic formation Contact Time Base Time Standby Power 功率POWER 壓力FORCE Contact Power Base Power Impact Force Contact Force Base Force Search Time Rel. Time Rel. Power 行程 5: 完成第一點壓焊後, 焊頭上升到反向高度 Stage 5: After 1st Bond, BH Ascending to Reverse Height(RH) DIE 線夾“打開” WIRE CLAMP “OPEN” 反向高度 - RH 焊頭向上運動 BOND HEAD MOVE UP 行程 6: 反向距離 Stage 6: Reverse Distance XY 工作台運動 X-Y TABLE MOVEMENT 線夾“打開” WIRE CLAMP “Open” 反向距離-RD DIE 行程 7: 焊頭上升到線弧高度位置 Stage 7: BH Ascending to Loop Top Position 線夾關上後, 開始第一點壓焊檢測 M/C ST