BGAProcessFlow分析报告.ppt

Single Die BGA PROCESS FLOW PRESENTATION Single Die BGA PROCESS FLOW PRESENTATION Single Die BGA PROCESS FLOW PRESENTATION单层芯片BGA产品工艺流程简介 BGA OPERATION * HOW TO ASSEMBL SINGLE DIE BGA 如何封装单层芯片BGA产品 WAFER WAFER MOUNT WAFER SAW TAPE UV DIE ATTACH GLUE CURE GLUE SUBSTRATE PLASMA CLEANING WIRE BONDING PLASMA CLEANING MOLDING LASER MARKING SOLDER BALL PLACEMENT PACKAGE SINGULATION ASSEMBLY TESING FINISHING DRY BAKING TESTING PACKING FINISHING POST MOLD CURE BACKGRINDINGPOLISHING WIRE RESIN SOLDER BALL PROCESS FLOW DIRECT MATERIAL * WAFER MOUNTING 晶圆贴片 Lintec RAD2500F8 Operation: Mounting the wafer by sticky foil 操作：用贴片膜把晶圆贴在框架上 Aim: To sustain and hold the wafer during sawing and after sawing 目的：在切片及其他工序中保持晶片和芯片稳固的位置 Wafer Ring Frame Mounted Wafer Structure TAPE * WAFER SAW 晶圆划片 DISCO DFD6361 Operation: Sawing the wafer through the scribing streets 操作：沿切割道切割晶圆 Aim: To separate the dice 目的：将晶圆切割为芯片单元 Dice Scribing streets Z1 Operation Wafer partially cut to improve front chipping Blade Wafer TAPE Z2 Operation Through cut Wafer Tape Blade Diamond * TAPE UV CURE 紫外线照射老化 Lintec RAD2000F/8 Wafer Ring Frame TAPE UV Operation: Expose the mounted wafer with sticky foil under UV 操作：用紫外线照射完成了晶圆贴片的产品 Aim: To cure resin, improve dicing and picking up performance 目的：使薄膜中的树脂固化，改善切片及粘片工序的表现 Make it releasable between Wafer TAPE * DIE ATTACH 贴片 ESEC 2008HS3+ Operation: Pick and place dice into right position by bond head 操作：由机械手抓取芯片并放到正确的位置上 Aim: To attach the dice onto the substrate 目的：将芯片从切割好的晶圆上放置到基板上 Vacuum Bond head N2 Dice Glue Substrate * GLUE CURING 银胶老化 DAC BLUE-M OVEN Operation: Heating according to preset temperature profile after die attach. 操作：按照预先设定的温度曲线加热产品老化银胶 Aim: To cure the glue, form a strong and stable adhesion between die and substrate 目的：使银胶老化，使芯片与基板紧密粘结 GLUE CURING Thermosetting tape resin curing Sticking force increased * PLASMA CLEANING 等离子体清洗 BALZERS LFC 150 Operation: Use plasma to clean the surface of die and substarte 操作：用等离子体处理芯片和基板表面 Aim