波峰焊接及其缺陷分析 毕业论文.docVIP

毕业设计论文 作者 学号 系部 机电学院 专业 题目 波峰焊接及其缺陷分析 指导教师 评阅教师 完成时间： 毕业设计(论文)中文摘要 题目：波峰焊接及其缺陷分析 摘要：波峰焊是指将熔化的软钎焊料（铅锡合金），经电动泵或电磁泵喷流成设计要求的焊料波峰，亦可通过向焊料池注入氮气来形成，使预先装有元器件的印制板通过焊料波峰，实现元器件焊端或引脚与印制板焊盘之间机械与电气连接的软钎焊，也可称为群焊或流动焊。这种焊接方法主要用于传统通孔插装工艺，以及表面组装与通孔插装元器件的混装工艺，适合波峰焊的表面贴装元器件有矩形和圆柱形片式元件、SOT以及较小的SOP器件等。 本文通过介绍波峰焊的定义、工艺方式、过程分析、缺陷分析等，提出波峰焊接的各种缺陷以及解决的各种方法。 关键词： 波峰焊 缺陷 分析 毕业设计(论文)外文摘要 Title : Wave Soldering Introduction and Its Defect Analysis Abstract: Wave soldering refers to the soft melt soldering material (lead tin alloy)， the electric pump or electromagnetic pump spray flow into the design requirements solder， it also can through peaks to inject nitrogen to form solders pool， with components in advance by the wave， PCB soldering welding side or of components with pins PCB pad of mechanical and electrical connection between the soft brazing， can also be called group of welding or flow welding. This kind of welding method is mainly used in traditional through-hole cartridge process， as well as surface assembly and through-hole cartridge components for dual wave soldering process， SMT components are rectangular and cylindrical electronic component， SOT and smaller SOP devices， etc. This paper introduces the definition， wave soldering process method， process analysis， defect analysis in the operating process and puts forward the methods of soldering defect and solved all kinds of the soldering defects. Keywords: Wave Soldering Defects Analysis 目 录 毕业设计（论文）中文摘要···········································1 毕业设计（论文）外文摘要···········································2 1引言······························································4 2波峰焊工艺························································4 2.1波峰焊的定义················································4 2.2波峰焊的种类·························