基于ansys大功率led器件的封装结构优化设计-大学毕业（设计）论文说明书.docVIP

编号： 毕业设计说明书 题 目： 大功率LED器件的封装 结构优化设计 题目类型：(理论研究 (实验研究 (工程设计 (工程技术研究 (软件开发 摘 要 本文以某大功率LED为背景，在查阅国内外大量文献的基础上，经过对各种参数化建模和优化技术方法的探索和研究，提出了直接在有限元平台上利用APDL语言进行其温度场和应力场分析的基础上，对该LED结构参数优化设计。 本文中，针对一种功率半导体器件——大功率LED照明灯具的封装与组件进行散热设计，通过有限元模型，分析其在工作状态时的稳态温度场分布，发现LED封装整体的温度梯度比较大，而封装陶瓷基板和热沉基座是阻碍器件散热的主要部分。为此，提出几种LED的优化方案，并进行了简单分析。 本文的优化设计可从三个方面对所选用的LED进行封装结构优化设计： 第一种情况：优化目标为芯片温度，约束条件为各尺寸的范围，在第7次达到优化。由最佳优化系列可以看出，芯片的最高温度已降至56.399℃，比优化前降低了将近20%。 第二种情况：优化目标为结构重量。对结构重量优化时，约束条件为各尺寸的范围，状态变量取芯片温度。经过13次后收敛，在第10次时最优，重量值为8.1873g； 第三种情况：优化目标为Von Mises应力，当优化目标为封装应力时，约束条件取各尺寸范围，状态变量分别为芯片温度和结构重量，在达到最优时，最大应力为50.052MPa，降幅达11.3%。 关键词：大功率LED；散热；有限元模拟；ANSYS；结构优化 Abstract The method of 3D Parametric-modeling by APDL language is pointed out for some LED in this paper. This work is based on a lot of references and many theories about parametric modeling, and structural optimization. Furthermore, the structural optimization for the LED is finished after a series of work including the analysis of the temperature gradient and the stress gradient. In this paper, the thermal analysis of package products in a high-power white LED light fitting was investigated in this paper. According to the FEM calculation, the static temperature field in the working process was analyzed. The temperature gradient in the LED package structure was found. Ceramic substrate and heat-sink base were considered as the main part to block heat dissipation. Therefore, several optimization designs of LED were put forward, and their simulation results were analyzed simply. The optimization of this article can be chosen from the three aspects of the LED package structure for optimal design. The first kind of circumstances: the objective function was chip temperature, and constraint condition was each size range. There was the optimization in the seventh time. From the best series, it can be seen that the highest temperature of chip has fallen to 56.399 degrees Celsius than bef