SystemInterconnectionDesignTradeoffsinThreeDimensional(3D)IntegratedCircuits研讨.ppt

* * * * * * * From the design methodology we estimated that Ha=104 is the optimum value for delay balancing. With that Ha, energy saving is 8%. Delta_Ttrad=168 ps, Delta_Tsmrt=148 ps * * * * * * * * It is important to being able to decide the implementation style at the early in the design phase. 80% of product cost is determined by the first 20% of design cycle. * * * * * * * * * * * * * * * * * * * RW, December, 2008 * Trade-off Parameters Area (Footprint) Worst-Case Delay Yield Cost Temperature Source: Chip Area, Technology Fusion, Mixed-Signal Integration Wafer, Packaging, Testing, Rework and Repair RW, December, 2008 * Chip/Module Cost Model Flow Gate Count Technology Parameters Die Area Bare Die Cost Test, Package Cost Chip Cost Substrate Cost Assemble (Cost, yield) Test (Cost, Yield) Repair (Cost, Yield) Detailed models and flow is described in Chapter 5. RW, December, 2008 * Performance – Latency ? L=0.12μm Wires in SoC: small and resistive SoP: fat and low resistive (LC transmission lines) 3D : shorter in length, direct vertical communication Performance of SoC is not necessarily better ? RW, December, 2008 * Chip/Package Temperature Model Thermal integrity is a critical issue for even conventional chips because the system reliability is strongly dependent on the temperature. Assuming the heat dissipates through the Silicon substrate, the average die temperature can be usually described If the same assumption is made that the die size is much larger than its thickness, the maximum temperature in a 3D-IC Source: Mahajan et al. Cooling a Microprocessor Chip, Proceedings of the IEEE T3DTmax ? Insert T-vias Done! yes no RW, December, 2008 * Case Studies Mobile Terminal 128Mb DRAM, 300K logic and 500K ASIC 2mm2 analog/RF, and CMOS image sensor (8 Megapixel, and pixel size 1.75 ?m X 1.75 ?m) Areas in mm2: ASIC uP DRAM Image Sensor Analog/RF 0.750 0.644 5.44 24.5 2 Wireless Sensor 2Mbit DRAM, 300K logic, and 500K ASIC, 2mm2 analog/RF, and Sensor