厚金属板激光切割及其关键技术的答题.doc

PAGE  PAGE III 厚金属板激光切割 及其关键技术的研究 院 系：信息科学与技术系 专 业 班：光信0802班 姓 名：邹 博 琼 学 号：20081182059 指导教师：李 宏 棋 2012年5月  厚金属板激光切割 及其关键技术的研究 Thick sheet metal laser cutting research on its key technologies 摘 要 激光切割加工是激光加工的一个重要领域，它是将激光束照射到物体表面，利用热能或材料融化时产生的化学热能熔化材料，以达到切割物体表面的目的，具有切割质量好、切割速度快、清洁、安全、无污染等特点。激光切割广泛应用于汽车、计算机、电器机壳制造等行业，激光切割还应用于微芯片、液晶屏短路环、陶瓷材料。目前由于钢结构、压力容器、船舶、桥梁等行业常常使用 12mm 以上钢板，如果激光能够高效柔性地切割这些金属材料，无疑将有很大的市场前景，为此，研究厚金属板激光切割对激光切割进一步具有较强的实现意义。 本论文首先分析了激光切割在国内外的发展状况，然后根据激光切割的原理，分析了激光切割厚金属板的过程。通过聚焦透镜的变化来改变激光光束的焦点位置，从而达到切割厚金属板的目的。接着提出了厚板切割所存在的问题，并分析了问题产生的原因，以及解决这些问题采取的措施。这些措施主要包括：提高激光器功率、脉冲方式加工、使用新型激光器、自适应光学系统、双聚焦法和辅助气流。最后从激光光束质量的角度，阐述了影响激光切割的因素。 关键字：激光切割 金属厚板 聚焦镜 光束质量 Abstract Laser cutting is an important field of laser processing, it is a laser beam to the surface, use of thermal energy or material melting chemical heat when melting materials in order to achieve the objective of cutting surface, with processing speed, high precision, without mechanical, process small material deformation, damage to material characteristics. Laser cutting is widely applied in industries such as automobile manufacturing, computers, electrical appliances casing, laser cutting also applied to micro-chip, LCD, short circuit rings, ceramic materials. Now, pressure vessel, ships, bridges and steel structure industry often uses 12mm plate, if the laser to cut efficiently with flexible metal, will no doubt have a lot of market prospects, to that end, research on laser cutting laser cutting thick metal plates to further implementation with a strong meaning. This paper first analyses the development of laser cutting at home and abroad, and based on the principle of laser cutting, analysis of the laser cutting process of thick metal plates. Changes to change the laser beam through a focusing lens focus position, so as to achieve the objective of cutting thick metal plate. Then raised the issue of thick plate cutting, and analysis of the causes of the problem, and measur