LED芯片与封装技重点.doc

PAGE 26  PAGE II 编号 本科生毕业设计（论文） 题目： LED芯片与封装技术研究 理 学院 光信息科学与技术 专业 学 号 1302070214 学生姓名 王 刚 指导教师 钱维莹 副教授 二〇一一年六月 摘要 摘 要 在21世纪，大功率LED照明技术的发展引起了国内外光源界大的普遍关注，现已成为具有发展前景和影响力的一项高新技术产品。本论文主要阐述了LED芯片制造与封装技术。芯片制造方面，从半导体制造的角度分解芯片制造的流程，从衬底的角度分析芯片散热，以及外延表面粗化和图形衬底技术来改善出光效率；封装技术方面，初略介绍几种常见封装方法和LED封装流程，重点就封装材料对大功率LED 散热和出光的影响，如芯片导热银胶、导热绝缘垫、散热基板等,并对高取光率封装的结构作了分析, 本文旨在研究大功率LED是如何提高散热以及出光效率的。 关键词: 芯片制造；封装技术；散热；出光效率 Abstract Abstract Abstract ABSTRACT In the 21st century, the development of high power LED lighting technology at home and abroad were light caused widespread concern, already became the potential and influential a high-tech products. This thesis mainly expounds the LED chip manufacturing and packaging technology. From the Angle of semiconductor manufacturing process, the decomposition chip manufacturing from the perspective of the substrate, and the extension of the chip heat surface coarsening and graphics substrate to improve the light efficiency; Encapsulation introduced briefly several common encapsulation technology and LED encapsulation process, with emphasis on the packaging materials for high power LED heat and output light efficiency. Discussed the chip thermal silver glue, thermal insulation mat, thermal substrate, analyzes the high take such as the structure of light rate package, this paper points out high power LED is how to improve the efficiency of heat and light. Keywords: Chip Manufacturing; Encapsulation Technology; Heat; Output Light Efficiency 目录 目录 PAGE 25  PAGE 25 目 录  TOC \o 1-3 \h \z \u  HYPERLINK \l _Toc295416799 摘 要  PAGEREF _Toc295416799 \h I  HYPERLINK \l _Toc295416800 ABSTRACT  PAGEREF _Toc295416800 \h II  HYPERLINK \l _Toc295416801 目 录  PAGEREF _Toc295416801 \h i  HYPERLINK \l _Toc295416802 第一章 绪论  PAGEREF _Toc295416802 \h 1  HYPERLINK \l _Toc295416803 1.1照明发展史  PAGEREF _Toc295416803 \h 1  HYPERLINK \l