封装设备.pptVIP

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  • 2016-08-22 发布于河南
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封装设备

Company Profile Sept’2011 Our Mission To Customer Contents Company Overall Introduction Company History Company Organization and Sales Service Network Company Vision Sales Record Technology and Patent Status Ball Mounting Technology for PCB Lamination Product Ball Mounting Technology for Singulated PCB Product Packaging Automation Technology Camera Module Application Technology Final Test Application Technology Location -. Head Quarter (RD) : 82B-9L , Nam-dong Industrial Complex 679-8, Gojan-dong Namdong-gu, Incheon, Korea -. China Shanghai Office : H.Y-Lee (e-mail : hylee@sspinc.co.kr ) (Tel:86 -. China Shenzhen Office : Jammy (e-mail : jammy@sspinc.co.kr) (Tel : 86-13-824318859) -. Singapore/Malaysia Office : SOE (e-mail : soe@sspinc.co.kr) (Tel : 65 -. Philippines Office : Joven (e-mail : joven@sspinc.co.kr) (Tel : 63-91 -. Taiwan Agent (Sellinng-Ware Co.,LTD : Richard Cheng (e-mail: richard@.tw) (Tel : 8863-5970052) -. Malaysia Penang Agent(Optima) : YC SOO (e-mail: ycsoo@) (Tel : 604-626-6379) Company Overall Introduction Established : June 20, 1996 C.E.O : K.H. LEE Home Page : www.sspinc.co.kr E-mail : sale@sspinc.co.kr Tel : 82-32-822-0881~4 (Head Quarter) Fax : 82-32-822-0886 Company History Jun’ 1996 : Founded

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