TACHECKLIST_to_customer.docVIP

A KYOCERA GROUP COMPANY Failure Investigation Data Checklist ___________________________________________________________ Date: Customer: Rep: Contact: Phone: FAX: ___________________________________________________________ 1. What is the part type and capacitance / voltage giving cause for concern?/D/C or INV NO e.g. 料號的型号是什么？. ____ _______ D/C: _______________________________ INV NO: _______________________________ 2. How do the parts fail? Open circuit, short circuit, parametric Cap, DF, ESR, DCL — 如何產生不良?電路缺口，短路，参数 _____________________________________ 3. How long has the present design and revision level of the board been under construction? 已產生多長時間在目前的设计版本的電路板中? _________________________________ 4. When did failures start to occur? Failures %？ 什么時候产生不良？不良率多少？ ________________ 5. Are other vendors parts used in the same application? 是否有其它供应商的产品在同一情况下使用? ________________ Are other vendor parts also failing? 其它供應商的产品是否也产生了不良? ________________ 6. Have there been any recent modifications to board or process? 最近是否有對电路板進行修改或是处理? ________________ 7. Are the same components used in other designs? 是否有在其它的设计中使用了同样的部件? ________________ 8. Please supply a brief description of the board manufacturing process. e.g— 请大致描述一下线路板生产过程，例如：________________ . 9. Soldering Profiles - Hand soldering, Wave soldering, reflow soldering 焊接 手焊 波峰焊接 回流焊 What reflow system is used?—使用什么样的REFLOW系统。 Infrared 红外线 Convection hot air flow 热对流 Combination of convection and infrared红外线及热对流组合 10. What is the test procedure for the board testing?- 电路板的測试过程是如何? e.g. ICT opens / shorts check Functional test ESS etc. Please state the conditions of these tests and any additional burn in or temperature cycling testing. 请陈述这些測试和附加超负荷测试及温度循环測试的条件 ___________________________________________________ 11. When do the capacitors fail? e.g. digital power up during ICT—当電鎔產生的不良情況。例如 : ____________________________ a At opens/shorts check 電路缺口/短路 Reflow conditions are most likely application caus