BGAUnderfillPerformance-Reliability.pptVIP

Celestica Confidential UnderfillExperience and Reliability Underfill BGA are typically not underfilled Mechanical stress (vibration, impact) usually most important for BGA applications Larger solder ball size and higher standoff already increases reliability More difficult to rework a component with underfill May not be able to clip on a heat sink Flip Chips, CSPs often are underfilled Flip chip reliability is very bad without underfilling Fine pitch CSP often fail very quickly without underfilling Underfill couples chip to substrate, relieves stress/strain from joints CSP normally looking fo