科技论文模板技术总结.docVIP

科技论文写作报告 题目: 半导体管自动涂胶机 —主工作台和涂胶机构设计 所 属 系 机械工程 专 业 机械设计制造及其自动化 学 号 041065 姓 名 指导教师 起讫日期 2010.3-----2010.6 设计地点 东南大学成贤学院 论文诚信承诺 本人承诺所呈交的及取得的成果是在导师指导下完成，引用他人成果的部分均已列出参考文献。如论文涉及任何知识产权纠纷，本人将承担一切责任。 学生签名： 日 期： 摘 要  Semiconductors automatic coating machine- Main table and the adhesive mechanism design Abstract Described in this paper focuses on automatic coating machine for semiconductor device - the main table and the adhesive mechanism design. The semiconductor tube is basically artificial adhesive glue, have relatively low production efficiency, quality can not be guaranteed. This design semiconductors automatic coating machine, coating technology to achieve automation. Table design uses eight station disk-type vertical wheel, with ratchet, pawl bodies to achieve the gap rotating turntable. Each station set thimble and spring to clamp or loosen semiconductors. Thimble installed bearings and gears, when the thimble rotation to the coating station, the gear and motor gear mesh, so that thimble, and semiconductor device with rotating, uniform coating benefit. Rotary table is cantilever mounted to facilitate the installation of automatic nesting in the lower body. Adhesive mechanism design with imitation artificial pendulum rod coating, the structure is simple and reliable to overcome the needle tube dripping machine needle is easy to plug the shortcomings, and saves the cost of plastic. All the major pure mechanical design, reliability, long life, be able to achieve fully automated coating.  Key words: Semiconductor Tube; Coating Machine; Main Table; Automation 目 录 第一章 绪论 1 1.1课题背景和研究意义 1 1.2发展现状和应用前景 2 1.3课题主要研究的内容 5 1.4课题研究主要的难点 6 第二章 涂胶机构的设计 7 2.1涂胶方式的选择 7 2.2摆杆的固定 9 2.3胶液池的设计 10 第三章 主工作台的设计 11 3.1主工作台方式的确定 11 3.2半导体管夹紧装置的选择 11 3.3一对齿轮的选择 12 3.4圆盘的确定 14 3.5定位块的选择和放置 15 3.6主轴的选择 16 第四章 总结与展望 18