DIY Repap3D打印机主板.docVIP

你需要一个。 This board contains surface mount parts.该电路板包含表面贴装部件。 The hardest part about SMT soldering is getting over your fear and staying calm.关于SMT焊接最难的部分是在你的恐惧和保持平静。 完全初学者没有任何问题。 There are four parts to building a surface mount board using the Hotplate Reflow Technique :有四个部分，建设表面贴装板采用回流焊炉技术 ： Apply solder paste to every exposed SMD pad应用焊膏每SMD焊盘裸露 Place each SMD component on its appropriate pad其适当的垫放在每个SMD元件 Place populated board on a cold hotplate.在一个寒冷的烤盘放置填充板。 Turn hotplate on.打开烤盘上。 Board solders itself!董事会焊料本身！ Solder in remaining through hole components.通孔元件焊锡剩余。 1. 1。 Apply Solder Paste 应用焊膏 Okay, so this part is pretty easy: get your solder paste syringe and start applying solder paste to every SMD pad.好了，这部分是很简单：让你的锡膏注射器并开始应用到每个焊膏贴片垫。 I like to use a squeeze/tap method.我喜欢用一挤/水龙头的方法。 That is, I squeeze a bit of solder paste out, then tap the place where it goes, rinse and repeat for every exposed pad.也就是说，我挤了出来焊膏位，然后点击它去的地方，干净，并为每个裸露焊盘的重复。 Do not put solder paste on pads with holes in them.不要把与焊接垫贴在破洞。 Youll solder those in step #4.您将在步骤＃4焊料的。  In order to get the right amount of solder paste on the pads for the small TQFP parts, use your finger to smear the paste like shown in this picture.为了让青少年对小TQFP封装的焊盘部分焊膏适量，用你的手指涂抹像这张照片显示粘贴。 It looks ugly, but youll get much fewer solder bridges this way.它看起来丑陋，但你会得到多少这样少焊桥梁。  2。 Place Components 放置组件 This is probably the trickiest part, but its not too bad once you get the hang of it.这可能是最棘手的部分，但它不是太糟糕了，一旦你熟悉了它。 The nice thing is that if you mess up, you can reposition the component all day.好事是，如果你陷入困境，你可以重新定位元件的所有日子。 You can even wipe off the solder paste and start over if you like.你甚至可以擦掉焊膏和重新开始，如果你喜欢。 Very forgiving to the beginner.非常宽容的初学者。 The individual components to place are shown below.单个组件放置如下。 Its easiest with tweezers and some sort of magnification.其最简单的镊子和一些放大排序。 A bit of patience and youll get it no problem.耐心一点，你就会得到它没有问题。 Since nothing gets soldered yet, you can easily try and