电子封装工艺英语.docVIP

surface mounted components/surface mounted devices SMC/SMD 表面组装元器件surface mount technology SMT 表面组装技术surface mounted assembly SMA 表面组装组件reflow soldering 再流焊 hot air reflow soldering 热风再流焊IR reflow soldering; infrared reflow soldering 红外再流焊Reflow atmosphere 再流气氛 laser reflow soldering 激光再流焊wave soldering 波峰焊 dual wave soldering 双波峰焊beam reflow soldering 光束再流焊 vapor phase soldering VPS 气相再流焊assembly density 组装密度terminations 焊端lead foot; lead 引脚fine pitch devices FPD 细间距器件solder powder 焊料粉末thixotropy 触变性:流遍体（流变体焊膏）的粘度随着时间、温度、切变力等因素而发生变化的特性。slump踏落no-clean solder paste 免清洗焊膏adhesives 贴装胶curing 固化screen printing 丝网印刷screen printing plate 网版screen printer 丝网印刷机stencil printing漏版印刷metal stencil; stencil metal mask 金属漏版snap-off-distance 印刷间隙flexible stencil 柔性金属漏版dispensing滴涂 表面组装时，往印刷版上施加焊膏或粘装胶的工艺工程 stringing 挂珠 teach mode programming 示教式编程drying; prebaking 干燥 off-line programming 脱机编程tape feeder带式供料器stick feeder 杆式供料器placement accuracy 贴装精度rotating deviation 旋转偏差placement direction 贴装方向flying 飞片 skewing 偏移 camellia 2004-12-07 02:18 PM Wave height 波峰高度Drag angle 牵引角（波峰顶水平面与印制板前进方向的夹角）Depth of impregnated 压锡深度Flux 助焊剂 diluent 稀释剂 （用于调整助焊剂密度的溶剂）thinner稀释剂（带有或不带有活化剂的液态化学制剂或膏状物，将其添加到焊膏中以调节焊膏粘度和固体含量）Antioxident 防氧化剂Solder joint 焊点Icicles 拉尖Bridging 桥连Dummy land工艺焊盘In-circuit testing 在线测试Visual inspection 目视检查Electrostatics discharge ESD 静电放电 Static sensitivity 静电敏感器Electrostatics susceptivity 静电敏感度Electrostatics induction 静电感应Coefficient of thermal expansion CTE 热膨胀系数Double in-line package DIP 双列直插式封装Quad flat packing QFP 方形扁平封装 Plastic quad flat packing PQFP 塑料方形扁平封装Metal electrodes leadless face components MELF 金属电极无引线端面元件Small outline package （SOP） 小外形封装 jasmine_wang_bj 2004-12-09 06:08 PM 呵呵，基本上不懂 johnsan 2004-12-11 03:16 PM Thanks? Thanks foolsome 2004-12-15 06:36 PM 好帖子,!!顶? 好帖子,!!顶 VICTOR 2004-12-16 12:38 PM [size 4]看不懂,得好好学学!先下载了。THANKS fushiwu 2004-12-16 01:05 PM 一点也看不懂，一定努力学 独