超细金属粉体电子浆料的制备及应用.docVIP

基础研究 成果名称 超细金属粉体、电子浆料的制备及应用 微波介质材料的合成与器件 联系人 吴松平 电 话 1座机电话号码96 电子邮件 chwsp@scut.edu.cn 学科领域 电子新材料与器件 应用背景 微电子厚膜电路 多层陶瓷片式器件（如片式电容、电阻、电感等） 先进射频器件（如天线、滤波器等） 创新点 单分散、无团聚亚微米（纳米）级粉体颗粒的低成本制备及其在微电子领域的应用。 电子油墨/浆料制备的关键技术及其流变学理论与实践。 微电子厚膜的微结构、附着力和界面结合机理研究与实践。 代表性论文 Wu SP, Ni J, Jiao L, et al., Preparation of ultra-fine copper-nickel bimetallic powders with hydrothermal-reduction method?, MATERIALS CHEMISTRY AND PHYSICS 105 1 : 71-75 SEP 15 2007 Wu SP, Ding XH, Preparation of fine copper powder with chemical reduction method and its application in MLCC?, IEEE TRANSACTIONS ON ADVANCED PACKAGING 30 3 : 434-438 AUG 2007 Wu SP, Preparation of ultra-fine copper powder and its lead-free conductive thick film, MATERIALS LETTERS 61 16 : 3526-3530 JUN 2007 Wu SP, Gu GB, Extraction of gold, palladium, and platinum from acidic media with cyclic sulfoxide derivative, JOURNAL OF UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING 14 2 : 107-111 APR 2007 Wu SP, Preparation of ultra fine nickel-copper bimetallic powder for BME-MLCC?, MICROELECTRONICS JOURNAL 38 1 : 41-46 JAN 2007 Wu SP, Preparation of fine copper powder using ascorbic acid as reducing agent and its application in MLCC?, MATERIALS LETTERS 61 4-5 : 1125-1129 FEB 2007 Wu SP, Preparation of micron size flake silver powders for conductive thick films?, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 18 4 : 447-452 APR 2007 Wu SP, Termination of BME-MLCC using copper-nickel bimetallic powder as electrode material?, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES 29 4 : 827-832 DEC 2006 Wu SP, Meng SY, Preparation of micron size copper powder with chemical reduction method?, MATERIALS LETTERS 60 20 : 2438-2442 SEP 2006 Wu SP, Qin HL, Li P, Preparation of fine copper powders and their application in BME-MLCC, JOURNAL OF UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING 13 3 : 250-255 JUN 2006 Wu SP, Meng SY, Zhuang ZQ, et al., Preparation of ultrafine silver coated BaTiO3 powder?, RARE METAL MAT