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Rheological Characterization and Full 3D Mold Flow Simulationin Multi-Die Stack CSP of Chip Array Packaging Min Woo LeeJin Young KhimMin YooJiYoung Chung and Choon Heung Lee Amkor Technology Korea 280-82-gaSeongsu-dong Seongdong-guSeoulKorea email: leemw@amkor.co.krphone: 822-460-5293 Abstract According as high density packaging options such as 2 or more die staking or package stacking technologies are developedthe major mold process related quality concerns such as incomplete moldexposed wires and wire sweeping are increased because of their narrow spaces between die top and mold surfa