SMT-08 Gas Controls CD.pptVIP

Semiconductor Manufacturing TechnologyMichael Quirk Julian Serda ? October 2001 by Prentice HallChapter 8 Gas Control in Process Chambers Objectives After studying the material in this chapter, you will be able to: 1. Explain why process chambers are used in semiconductor manufacturing. 2. Describe the benefits of vacuum, the vacuum ranges and appropriate pumps. 3. Explain the need for gas flow in process chambers and how it is controlled. 4. Explain what is an RGA and why it is beneficial in process chambers. 5. Describe what is a plasma and how it is obtained. 6. Discuss the effects of contamination in chambers and how to minimize it. The Many Functions of Process Chambers Controlling how gas chemicals flow into and react in the chamber in close proximity to the wafer. Creating a vacuum environment. Removing undesirable moisture, air and reaction by-products. Creating an environment for chemical reactions such as plasma to occur. Controlling the heating and cooling of the wafer. Early 1960s Vacuum Bell Jar Integrated Cluster Tool Vacuum Benefits of Vacuum Vacuum Ranges Mean Free Path Benefits of Vacuum in Semiconductor Manufacturing Vacuum Ranges Mean Free Path and Molecular Density Versus Pressure Vacuum Pumps Roughing Pump Dry Mechanical Pump Blower/Booster Pump High Vacuum Pump Turbomolecular Pump Cryopump Vacuum in Integrated Tools Roughing Pump Exhausting a High Vacuum Pump Rotary Claw Dry Mechanical Pump Roots Blower Pump Turbo Pump Blades Cryopump Compressor and Pump Module Cryoarray Surfaces in Pump Module Cluster Tool Layout with Vacuum Environment Process Chamber Gas Flow The basic process chamber requirements for gas flow are:* Ability to handle a wide variety of bulk and specialty gases, many of which are corrosive and toxic. The control of gas flow into the process chamber is accurate and repeatable. The gas mix proportions are able to be controlled during the process run. Materials used in the chamber are not affected by the process gases