PCB制作过程图解.pptVIP

PCB is now complete except for surface finishes and panel routing Layer 6 Layer 1 Via Hole SMD Pad Tracks Tracks Solder Mask Application - Curtain Coated Method Layer 6 Layer 1 Apply Liquid Photo-Imageable Resist, then dry Some PCB fabricators chose to check the impedance before the solder mask is added Structures can be checked in Normal and Coated mode Thickness of solder mask should be specified using C1 and C2 Impedance Considerations Solder Mask Application Image, Develop and Cure Layer 6 Layer 1 UV Image, Develop and Cure Impedance Considerations Does not effect impedance Surface Finish Process Layer 6 Layer 1 Apply Solder to Exposed Copper Areas Surface Finish (Tin / Lead / Gold / Silver) is usually only added to pads If board has no solder mask the thickness of finish should be added to T1. Impedance Considerations Component Notation SCL2 9624 Impedance Considerations Does not effect impedance Routing (includes second stage drilling) Impedance Considerations Controlled Impedance coupons are routed from the panel Good controls are necessary to ensure that coupons can be matched to manufacturing panels Process finished PCB and coupons fortesting Impedance Considerations It is good practice to place TDR coupons in the “X” and “Y” axis of the manufacturing panel to ascertain any process variations due to spray patterns when using horizontal conveyorised equipment. Coupons Process finished PCB and coupon fortesting Impedance Considerations Controlled Impedance coupons are routed from the panel Controls are necessary to ensure that coupons can be matched to manufacturing panels — this should be performed on trial panels prior to production ramp up. Why as a designer do you need to discuss your design with your PCB fabricator? Impedance Considerations PCB manufacture is a process, it uses materials which are not “ideal” FR4 for example is a glass resin mix madeof two substances with differing electrical properties. PCB Manufacturers need to m