LED知识(最完整版)-第一部分素材.ppt

Advantages of Flip chip: Good thermal conductivity In a chip: Thermal conductivity Metal (pad) GaN, SiC Sapphire Poor heat flow if sapphire substrate Very good heat flow via metal bump Substrate Active layer Conventional chip Heat flow Substrate Flip chip Metal bump Heat flow 材質改善 Ni/Au ITO(Indium Tin Oxideate) ZnO 電極材質 ZnO ITO Ni-Au 穿透率 80 80 60 阻抗率 1X10^-4 1X10^-4 1X10^-6 材料單價(美元/kg) Zn:1.1純度:99.99%Zn-300 In:6.5萬純度:99.99%In-1500 Ni:17.3Au:13.87萬 直徑5英吋燒結價格 1400 1700 --- 形成電極後熱處理 不需要 需要 需要 ITO LED Ni/Au T% ~ 70% T% 90% LED High Transparency +Ni/Au +ITO Same Grade Epi-Wafers after Proce