IPQA (In-Process Quality Assurance).pptVIP

IPQA (In-Process Quality Assurance) First Article Inspection(FAI) Sampling Inspection Patrol Inspection FAI Check two PCBAs when producing another model. Refer to: BOM, ECN/EC, Layout, Weekly Produce Plan Inspection Station: SMT Bonding MI PCBA Packing Sampling Inspection Inspection method: 1. General product for SMT: AQL Standard: ANSI/ASQZ1.4-2003 General Inspection Levels II Class. AQL: 0.65. Acceptable Standard: ≦400 PPM with IPC-A-610D Class II. 2. General product for Bonding: AQL Standard: ANSI/ASQZ1.4-2003 General Inspection Levels II Class. Acceptable Standard: MAJOR 0.65, MINOR 2.5. 3. General product for PCBA: AQL Standard: ANSI/ASQZ1.4-2003 General Inspection Levels II Class. Acceptable Standard: MAJOR 0.65, MINOR 2.5 with IPC-A-610D Class II. Inspection Station: SMT Bonding MI PCBA (Only for semi-product shipped by PCBA) Patrol Inspection-1 SMT Process: Measure solder paste viscosity Check refrigerator temp Check BGA/LGA/QFN soldering with 3D X-Ray, 5pcs/hour; Check PCBA workmanship, 5pcs/2 hour; Follow up ECN/EC ; Bonding Process: Measure temp of silver epoxy stored at refrigerator; Check Bonded IC workmanship,2pcs/day; Follow up ECN/EC; Patrol Inspection-2 MI Process: Measure the pre-heat temp, solder pot temp and flux density Check worker’s operation in accordance with the MEI/TEI requirement. Check PCBA workmanship, 5pcs/2 hour. Follow up ECN/EC. Assembly Process: Check worker’s operation in accordance with the MEI/TEI requirement. Check PCBA workmanship, 5pcs/2 hour. Follow up ECN/EC. Verify the test software. Verify the Mac address, S/No. information. Verify all kinds of labels’ content and printing quality. Gather data for SPC control ( Xbar-R Chart, P chart) Sampling Inspection OQA using the following plan for their sampling inspection if customer has not special requirement: AQL Standard: ANSI /ASQ Z1.4, Single Sampling Plan, Normal Inspection, Level II