半导体中英对.docVIP

HYPERLINK /forum.php?mod=viewthreadtid=332932extra=ordertype=1倒序浏览 0 | ? Acceptor - An element, such as boron, indium, and gallium used to create a free hole in a semiconductor. The acceptor atoms are required to have one less valence electron than the semiconductor.? 受主 - 一种用来在半导体中形成空穴的元素，比如硼、铟和镓。受主原子必须比半导体元素少一价电子? Alignment Precision - Displacement of patterns that occurs during the photolithography process. . u! F. W }! b# j4 q? 套准精度 - 在光刻工艺中转移图形的精度。 2 v I; S4 U, T* r d9 H3 b! c? Anisotropic - A process of etching that has very little or no undercutting , i( N: Z7 u; {3 z? 各向异性 - 在蚀刻过程中，只做少量或不做侧向凹刻。 : `3 v P1 s1 }3 z. `; ?? Area Contamination - Any foreign particles or material that are found on the surface of a wafer. This is viewed as discolored or smudged, and it is the result of stains, fingerprints, water spots, etc. + {7 c* p x H3 B0 m; r? 沾污区域 - 任何在晶圆片表面的外来粒子或物质。由沾污、手印和水滴产生的污染。 ) \6 f: K* N7 I8 r; W$ t m* P? Azimuth, in Ellipsometry - The angle measured between the plane of incidence and the major axis of the ellipse.? 椭圆方位角 - 测量入射面和主晶轴之间的角度。? Backside - The bottom surface of a silicon wafer. (Note: This term is not preferred; instead, use ‘back surface’.)? 背面 - 晶圆片的底部表面。（注：不推荐该术语，建议使用“背部表面”） 7 h4 p; ? D! j0 H( I0 X- x? Base Silicon Layer - The silicon wafer that is located underneath the insulator layer, which supports the silicon film on top of the wafer.? 底部硅层 - 在绝缘层下部的晶圆片，是顶部硅层的基础。? Bipolar - Transistors that are able to use both holes and electrons as charge carriers.? 双极晶体管 - 能够采用空穴和电子传导电荷的晶体管。 - ? x5 Q5 x d! A* P% y? Bonded Wafers - Two silicon wafers that have been bonded together by silicon dioxide, which acts as an insulating layer. ; o! k) {, @+ i( V# Z- Y? 绑定晶圆片 - 两个晶圆片通过二氧化硅层结合到一起，作为绝缘层。? Bonding Interface - The area where the bonding of two wafers occurs.? 绑定面 - 两个晶圆片结合的接触区。 : c H!