日本电气化学(Denka)散热铝基板中文课题.docVIP

Insulated Metal Substrate HITT PLATE 绝缘高导热铝基板 DENKI KAGAKU KOGYO K.K. 日本电气化学工业有限公司 DENKA QQ  适用与混合集成电路领域 .   Suitable field for IMS The 适用于工业管理学会  Ceramic substrate 陶瓷基片 Insulated Metal Substrate 绝缘金属基材  Substrate with thick film circuit.厚膜陶瓷线路板 Substrate with thin circuit.薄膜陶瓷线路板 Substrate Multi-layer 多层陶瓷线路板 Metal Base Substrate ( Al, Cu, Fe) 金属基材(铝,铜,铁) Metal Core Substrate (Al, Cu, Fe)金属芯基材(铝,铜,铁)  Metal Base Substrate with Multi-Layer (FR-4)多层环氧树脂金属基材 Paper based material (phenol) 纸基板(酚基材) Glass cloth based material (epoxy, polyimide)玻璃基材（环氧树脂，聚酰亚胺） Rigid substrate刚性基板 Organic substrate有机基板  Composite (combination with different materials)复合材料（与不同的材料结合） Thermoplastic resin 热塑性树脂 Film material (polyimide, polyester)薄膜材料（聚酰亚胺，聚酯） *Al base type基本类型  Conductor (Cu foil, etc.) 导体（铜箔等） Insulator绝缘层 Metal Base（Al, Cu, Fe, etc.)金属基材（铝，铜，铁等）  Ni plating 镍层  Al wire铝丝 Plastic case塑胶外壳  Semiconductor 半导体  Chip resistance 贴片电阻  Resin 树脂 Lead terminal引线端子  Insulator 绝缘层  Aluminum board 铝板  IMS 标准层 Improvement of Insulator 绝缘层的改善 →Higher thermal conductivity, higher reliability and higher heat resistance. 更高的导热系数，高可靠性和高耐热性. Industrial machine工业机器 Air conditioner  500  空调设备 HITT PLATE(IMS) 高导热铝基板  Alumina substrate 氧化铝层  AlN substrate氮化铝层  Audio音频  50  100  Rated current(A) 额定电流  Market request 市场需求  Cost down, down sizing and Higher thermal conductivity 低成本小型化高导热系数  Thermal 2W/mK conductivity导热系数  4W/mK