AN160-916.docVIP

AN1603 Multilayer Chip Antenna for 916MHz Wireless Communication Jan, 2007 Ver.0 1 of 9 http://www. J RainSun CorporationAN1603‐916 Multilayer Chip Antenna ◆ Features y Light weight and low profile 16.0mm(L)X3.0mm(W)X1.7mm(H) y Omni‐directional in azimuth y Lead (Pb) Free ◆ Applications y 916MHz wireless communications y 916MHz Modules Specifications Center frequency Peak gain 916MHz 0.5dBi Operation temperature Storage temperature VSWR Input Impedance Power handling Bandwidth -40 ~ +85 °C -40 ~ +85 °C 2.0 (Max) 50 Ohm 3W (Max) 10MHz Azimuth beamwidth Polarization Omni-directional Linear RainSun Corporation Jan, 2007 Ver.0 2 of 9 http://www. JPin configuration 1 2 Pin No Pin assignment Feed termination Feed point mark Solder termination 1 2 3 3 Dimensions Symbol Dimensions(mm) 16.0±0.1 A B C H 3.0±0.1 0.6±0.02 1.7±0.02 RainSun Corporation Jan, 2007 Ver.0 3 of 9 http://www. JRecommended Test Board Pattern Top view Bottom view 50 Ohm Transmission line Ground Plane SMA connector Unit : cm Board thickness : 0.6mm Board material : FR4 Fig-1 Testing Setup Measurement Testing Instrument: Anritsu 37369C VNA(Vector Network Analyzer) VNA calibrate with 1 path reflection only calibration sequence on test board feed point. The test board dimension and it’s layout is the same as Fig‐1. RainSun Corporation Jan, 2007 4 of 9 Ver.0 http://www. JTypical Electrical Characteristics Return loss Smith Chart Marker data: 1 : f=0.916 GHz RainSun Corporation 5 of 9 Jan, 2007 Ver.0 http://www. JTypical Electrical Characteristics 916MHz H‐Plane 916MHz E‐Plane RainSun Corporation 6 of 9 Jan, 2007 Ver.0 http://www. JTypical Soldering Profile for Lead‐free Process Peak temp 340°C 340°C 300°C 150°C 5 sec. 25 sec. Pre-heating Time (sec.) Do not exceed 30 secs. Reflow Soldering 10 sec, max 260°C 230°C 180°C 30 sec. 60 sec. Pre-heating Time (sec.) RainSun Corporation Jan, 2007 Ver.0 7 of 9 http://www. JPacking Blister Tape Specifications Symbol W Dimension 24.00 8.00 Tolerance ± 0.3