Flip Chip Process Briefing Introduce.ppt

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2016-12-17 发布于湖北
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Flip Chip Process Briefing Introduce.ppt

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Flip Chip Process Briefing Introduce FCOS Package Studbump for FCOS products(at preassembly) FCOS Procedure FCOS Procedure FCOS Procedure FCOS Procedure FCOS Procedure FCOS Procedure FCOS Procedure WB Training Material wire bond的目的用导线将半导体芯片上的电极（第一焊点）与外部引脚（第二焊点）相连接，完成芯片与封装外引脚间的电流通路。 1st bond 2nd bond 基本术语 Wire Bond Process 键合工艺详解 FCOS 工艺流程及常见产品 Work Station Layout FCOS FCOS Datacon Line – Zone Area FCOS Datacon Line – Inspection Area FCOS Datacon Line – Working Area FCOS Line – Working Station FCOS Muhlbauer Line – Zone Area FCOS Muhlbauer Line – Inspection Area FCOS Muhlbauer Line – Working Area Training Material for FCOS Flip Chip Theory 倒装焊原理过程控制 Visual inspection 1. 频率 1次/30分钟 2. 样本数 =12pcs 3. 工具：显微镜 4. 记录检查状况 Wafer mapping的检查在用wafer mapping生产时，可在做参考点的光片上用油性笔做个记号，以保证机器找到正确的参考点。 FCOS--倒装焊培训材料 Wire bond detail information Perfect Ball Shape Wire bond detail information Acceptance Ball Shape Wire bond detail information Bad Ball! Wire bond detail information Action: Increase the air pressure of wire tension Increase the EFO parameter to get a bigger free air ball Increase the wedge force and ultrasonic power to straighten the wire tail Change the capillary Wafer receiving Quantum Curing Inline Test Visual Inspection Electrical Testing OQA Packing Delivery MFC3.1 MFC5.6 MFC5.8 Area Owner: FCOS Working Station Input Buffer Output Buffer Tester Area Owner: FCOS Working Station Input Buffer Output Buffer Tester Fuguai Holder Lead tape Hanger Current Process Lot Traveler Scissor Pen Marker Pen Module Gauge TFM Air Gun Holder Area Owner: FCOS Working Station Input Buffer Output Buffer Tester Technician Tool. Equipment Parts. [During Repair] New Collet Technician Tool. Equipment Parts. [During Repair] Technician Tool. Equipment Parts. [During Repair] Quantum Eurotec Communication Sheet Communication Sheet Area