单片机课程设计报告(万年历).docVIP

目 录 一、摘要·········································································2 二、设计任务.····································································4 三、总体方案设计与论证···························································4 1、液晶显示模块·····························································4 2、实时时间计算模块·························································5 3、实时环境温度采集模块·····················································5 4、报警模块······························································6 5、设置模块······························································6 四、总体方案组成框图··························································7 五、系统硬件设计·····························································8 1、LCD显示模块··························································8 2、实时时间计算模块······················································12 3、实时环境温度检测模块·················································16 4、报警模块·····························································21 5、设置模块·····························································22 六、系统软件设计····························································23 七、系统硬件电路设计························································24 八、系统硬件PROTEUS仿真原理图············································25 九、系统硬件仿真运行情况图··················································26 1、显示欢迎界面·························································26 2、显示实时时间··························································26 3、显示当前温度··························································27 4、时间设置······························································27 5、最高报警温度设置······················································28 6、闹钟时间设置··························································28 7、超温··································································29 8、闹钟时间到····························································29 附录一：实物图······························································30 附录二：PCB图········